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"Isolation Techniques Against Substrate Noise Coupling Utilizing Through ..."
Shinichiro Uemura et al. (2012)
- Shinichiro Uemura, Yukio Hiraoka, Takayuki Kai, Shiro Dosho:
Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs. IEEE J. Solid State Circuits 47(4): 810-816 (2012)
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