"Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets ..."

Wei Tang et al. (2024)

> Home

Details and statistics

DOI: 10.1109/JSSC.2023.3343457

access: closed

type: Journal Article

metadata version: 2024-04-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/jssc/TangCHBZCLZTWMYYKFCTSZ24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jssc/TangCHBZCLZTWMYYKFCTSZ24
Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Rani Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Y. Shumarayev, Zhengya Zhang:
Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration. IEEE J. Solid State Circuits 59(4): 1235-1245 (2024)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.