"3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly."

Alberto Fazzi et al. (2007)

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DOI: 10.1109/JSSC.2007.905230

access: closed

type: Journal Article

metadata version: 2022-10-02

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Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri:
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. IEEE J. Solid State Circuits 42(10): 2270-2282 (2007)

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