"Feasibility study of modular plant for 300 mm-IC fabrications."

Suhua Hsieh, Chung-Rung Hung (2004)

> Home

Details and statistics

DOI: 10.1023/B%3AJIMS.0000018035.69841.61

access: closed

type: Journal Article

metadata version: 2020-09-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/jim/HsiehH04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jim/HsiehH04
Suhua Hsieh, Chung-Rung Hung:
Feasibility study of modular plant for 300 mm-IC fabrications. J. Intell. Manuf. 15(2): 233-244 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.