"Data mining for improving the solder bumping process in the semiconductor ..."

Chen-Fu Chien, Huan-Chung Li, Angus Jeang (2006)

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DOI: 10.1002/ISAF.273

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type: Journal Article

metadata version: 2022-10-04

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Chen-Fu Chien, Huan-Chung Li, Angus Jeang:
Data mining for improving the solder bumping process in the semiconductor packaging industry. Intell. Syst. Account. Finance Manag. 14(1-2): 43-57 (2006)

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