"O.O: Optimized one-die placement for face-to-face bonded 3D ICs."

Xingyu Tong et al. (2025)

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DOI: 10.1016/J.VLSI.2025.102371

access: closed

type: Journal Article

metadata version: 2025-03-04

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Xingyu Tong, Yuhao Ren, Zhijie Cai, Peng Zou, Min Wei, Yuan Wen, Zhifeng Lin, Jianli Chen:
O.O: Optimized one-die placement for face-to-face bonded 3D ICs. Integr. 102: 102371 (2025)

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