"Numerical simulation approach on stress and strain for chip scale package ..."

Yang Ping, Wei Li (2009)

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DOI: 10.1504/IJMTM.2009.026386

access: closed

type: Journal Article

metadata version: 2020-06-04

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Yang Ping, Wei Li:
Numerical simulation approach on stress and strain for chip scale package under thermal cycling. Int. J. Manuf. Technol. Manag. 18(3): 300-307 (2009)

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