"In-process force monitoring for precision grinding semiconductor silicon ..."

Jeremiah A. Couey et al. (2005)

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DOI: 10.1504/IJMTM.2005.007695

access: closed

type: Journal Article

metadata version: 2020-06-04

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Jeremiah A. Couey, Eric R. Marsh, Byron R. Knapp, R. Ryan Vallance:
In-process force monitoring for precision grinding semiconductor silicon wafers. Int. J. Manuf. Technol. Manag. 7(5/6): 430-440 (2005)

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