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"The simulation and analysis of stresses field of ceramic die in wire ..."

Xuefeng Yang et al. (2009)

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DOI: 10.1504/IJMIC.2009.027028

access: closed

type: Journal Article

metadata version: 2020-09-17

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  - https://dblp.org/rec/journals/ijmic/YangZWWZ09
Xuefeng Yang, Xiangbo Ze, Hong-Yan Wang, Hui Wang, Hui Zhang:
The simulation and analysis of stresses field of ceramic die in wire drawing process. Int. J. Model. Identif. Control. 7(1): 80-88 (2009)

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