"Failure probability of wire bonding packages."

F. Wang, Y. Y. Wang, C. Lu (2004)

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DOI: 10.1142/S1465876304002447

access: closed

type: Journal Article

metadata version: 2020-07-09

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F. Wang, Y. Y. Wang, C. Lu:
Failure probability of wire bonding packages. Int. J. Comput. Eng. Sci. 5(2): 379-386 (2004)

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