"Resilience and yield of flip-flops in future CMOS technologies under ..."

Christoph Werner et al. (2014)

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DOI: 10.1049/IET-CDS.2013.0122

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type: Journal Article

metadata version: 2024-10-06

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Christoph Werner, Benedikt Backs, Martin Wirnshofer, Doris Schmitt-Landsiedel:
Resilience and yield of flip-flops in future CMOS technologies under process variations and aging. IET Circuits Devices Syst. 8(1): 19-26 (2014)

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