"Design and management of high-performance, reliable and thermal-aware 3D ..."

Amir-Mohammad Rahmani et al. (2012)

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DOI: 10.1049/IET-CDS.2011.0349

access: closed

type: Journal Article

metadata version: 2022-04-09

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Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen:
Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip. IET Circuits Devices Syst. 6(5): 308-321 (2012)

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