"Post-Packaging Simulation Based on MOSFET Characteristics Variations Due ..."

Naohiro Ueda, Hirobumi Watanabe (2020)

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DOI: 10.1587/TRANSELE.2019ECP5038

access: closed

type: Journal Article

metadata version: 2021-01-18

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  - https://dblp.org/rec/journals/ieicetc/UedaW20
Naohiro Ueda, Hirobumi Watanabe:
Post-Packaging Simulation Based on MOSFET Characteristics Variations Due to Resin-Molded Encapsulation. IEICE Trans. Electron. 103-C(6): 317-323 (2020)

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