"Interdigital and Multi-Via Structures for Mushroom-Type Metasurface ..."

Taisei Urakami et al. (2024)

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DOI: 10.23919/TRANSCOM.2023EBP3131

access: closed

type: Journal Article

metadata version: 2024-09-11

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Taisei Urakami, Tamami Maruyama, Shimpei Nishiyama, Manato Kusamizu, Akira Ono, Takahiro Shiozawa:
Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors. IEICE Trans. Commun. 107(2): 309-320 (2024)

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