"Thermal-Aware Test Access Mechanism and Wrapper Design Optimization for ..."

Thomas Edison Yu et al. (2008)

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DOI: 10.1093/IETISY/E91-D.10.2440

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type: Journal Article

metadata version: 2022-01-03

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Thomas Edison Yu, Tomokazu Yoneda, Krishnendu Chakrabarty, Hideo Fujiwara:
Thermal-Aware Test Access Mechanism and Wrapper Design Optimization for System-on-Chips. IEICE Trans. Inf. Syst. 91-D(10): 2440-2448 (2008)

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