"A Region-Based Through-Silicon via Repair Method for Clustered Faults."

Tianming Ni et al. (2017)

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DOI: 10.1587/TRANSELE.E100.C.1108

access: closed

type: Journal Article

metadata version: 2020-04-11

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  - https://dblp.org/rec/journals/ieicet/NiLNXYH17
Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang:
A Region-Based Through-Silicon via Repair Method for Clustered Faults. IEICE Trans. Electron. 100-C(12): 1108-1117 (2017)

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