"The sprint process of Al interconnects with low-temperature PVD via filling."

Takashi Yoda et al. (2004)

> Home

Details and statistics

DOI: 10.1587/ELEX.1.263

access: open

type: Journal Article

metadata version: 2022-06-10

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/ieiceee/YodaETH04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/YodaETH04
Takashi Yoda, Hirokazu Ezawa, Kaori Tsutsumi, Makoto Honda:
The sprint process of Al interconnects with low-temperature PVD via filling. IEICE Electron. Express 1(9): 263-268 (2004)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.