"Upset and damage mechanisms of the three-dimensional silicon device ..."

Yang Li et al. (2019)

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DOI: 10.1587/ELEX.16.20190498

access: open

type: Journal Article

metadata version: 2021-02-12

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  - https://dblp.org/rec/journals/ieiceee/LiCLLWZLY19
Yang Li, Changchun Chai, Yuqian Liu, Yun Li, Han Wu, Wei Zhang, Fuxing Li, Yintang Yang:
Upset and damage mechanisms of the three-dimensional silicon device induced by high power microwave interference. IEICE Electron. Express 16(19): 20190498 (2019)

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