"Investigation of heat dissipation structure embedded in substrate of power ..."

Rui Hu et al. (2024)

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DOI: 10.1587/ELEX.21.20240185

access: open

type: Journal Article

metadata version: 2024-11-27

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  - https://dblp.org/rec/journals/ieiceee/HuLBYMD24
Rui Hu, Linhong Lu, Zhongchen Bai, Fashun Yang, Kui Ma, Zhao Ding:
Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias. IEICE Electron. Express 21(11): 20240185 (2024)

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