"3D Networks-on-Chip mapping targeting minimum signal TSVs."

Hui Ding et al. (2013)

> Home

Details and statistics

DOI: 10.1587/ELEX.10.20130518

access: open

type: Journal Article

metadata version: 2023-06-26

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/ieiceee/DingGYF13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/DingGYF13
Hui Ding, Huaxi Gu, Yintang Yang, Dongrui Fan:
3D Networks-on-Chip mapping targeting minimum signal TSVs. IEICE Electron. Express 10(18): 20130518 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.