"Analysis and evaluation of noise coupling between through-silicon-vias."

Yuuki Araga et al. (2021)

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DOI: 10.1587/ELEX.18.20210139

access: open

type: Journal Article

metadata version: 2022-02-03

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  - https://dblp.org/rec/journals/ieiceee/AragaWSK21
Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Analysis and evaluation of noise coupling between through-silicon-vias. IEICE Electron. Express 18(11): 20210139 (2021)

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