"Low-inductance decoupling capacitor for the thermal conduction modules of ..."

James N. Humenik et al. (1992)

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DOI: 10.1147/RD.365.0935

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - https://dblp.org/rec/journals/ibmrd/HumenikOWP92
James N. Humenik, James M. Oberschmidt, Leon L. Wu, Scott G. Paull:
Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors. IBM J. Res. Dev. 36(5): 935-942 (1992)

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