"Low-cost wafer bumping."

Peter A. Gruber et al. (2005)

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DOI: 10.1147/RD.494.0621

access: closed

type: Journal Article

metadata version: 2020-03-13

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  - https://dblp.org/rec/journals/ibmrd/GruberBBDLNOSTT05
Peter A. Gruber, Luc Bélanger, Guy P. Brouillette, David H. Danovitch, Jean-Luc Landreville, David T. Naugle, Valerie A. Oberson, Da-Yuan Shih, Chris L. Tessler, Michel R. Turgeon:
Low-cost wafer bumping. IBM J. Res. Dev. 49(4-5): 621-640 (2005)

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