"System-in-Package: Electrical and Layout Perspectives."

Lei He et al. (2011)

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DOI: 10.1561/1000000014

access: closed

type: Journal Article

metadata version: 2022-12-13

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Lei He, Shauki Elassaad, Yiyu Shi, Yu Hu, Wei Yao:
System-in-Package: Electrical and Layout Perspectives. Found. Trends Electron. Des. Autom. 4(4): 223-306 (2011)

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