"Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods."

Yi Lou et al. (2012)

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DOI: 10.1007/S10836-011-5261-4

access: closed

type: Journal Article

metadata version: 2020-09-11

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Yi Lou, Zhuo Yan, Fan Zhang, Paul D. Franzon:
Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods. J. Electron. Test. 28(1): 27-38 (2012)

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