"A Layer-Multiplexed 3D On-Chip Network Architecture."

Rohit Sunkam Ramanujam, Bill Lin (2009)

> Home

Details and statistics

DOI: 10.1109/LES.2009.2034710

access: closed

type: Journal Article

metadata version: 2022-08-01

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/esl/RamanujamL09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/esl/RamanujamL09
Rohit Sunkam Ramanujam, Bill Lin:
A Layer-Multiplexed 3D On-Chip Network Architecture. IEEE Embed. Syst. Lett. 1(2): 50-55 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.