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"High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and ..."
Manho Lee et al. (2016)
- Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim:
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016)
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