"Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array."

Dong Gun Kam et al. (2006)

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DOI: 10.1109/MDT.2006.78

access: closed

type: Journal Article

metadata version: 2020-05-17

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  - https://dblp.org/rec/journals/dt/KamKYCBL06
Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee:
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. IEEE Des. Test Comput. 23(3): 212-219 (2006)

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