"Reliability Challenges Related to TSV Integration and 3-D Stacking."

Kristof Croes et al. (2016)

> Home

Details and statistics

DOI: 10.1109/MDAT.2015.2501302

access: closed

type: Journal Article

metadata version: 2023-05-01

- view
  authority control:
- export record
  dblp key:
  - journals/dt/CroesMLGPCSWB16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/dt/CroesMLGPCSWB16
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne:
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33(3): 37-45 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.