"Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV ..."

Shu-Feng Cheng et al. (2019)

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DOI: 10.1109/MDAT.2019.2932935

access: closed

type: Journal Article

metadata version: 2020-03-13

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Shu-Feng Cheng, Po-Tsang Huang, Li-Chun Wang, Mau-Chung Frank Chang:
Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration. IEEE Des. Test 36(6): 63-71 (2019)

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