"MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet ..."

Lukas Pfromm et al. (2024)

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DOI: 10.48550/ARXIV.2410.09188

access: open

type: Informal or Other Publication

metadata version: 2024-11-22

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  - journals/corr/abs-2410-09188
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  - https://dblp.org/rec/journals/corr/abs-2410-09188
Lukas Pfromm, Alish Kanani, Harsh Sharma, Parth Solanki, Eric Tervo, Jaehyun Park, Janardhan Rao Doppa, Partha Pratim Pande, Ümit Y. Ogras:
MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures. CoRR abs/2410.09188 (2024)

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