"Multi-Modal Emotion Recognition for Enhanced Requirements Engineering: A ..."

Ben Cheng et al. (2023)

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DOI: 10.48550/ARXIV.2306.01492

access: open

type: Informal or Other Publication

metadata version: 2024-07-19

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  - https://dblp.org/rec/journals/corr/abs-2306-01492
Ben Cheng, Chetan Arora, Xiao Liu, Thuong Hoang, Yi Wang, John Grundy:
Multi-Modal Emotion Recognition for Enhanced Requirements Engineering: A Novel Approach. CoRR abs/2306.01492 (2023)

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