"3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs."

Reza Mirosanlou et al. (2019)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2019-01-31

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-1901-00568
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-1901-00568
Reza Mirosanlou, Mohammadkazem Taram, Zahra Shirmohammadi, Seyed Ghassem Miremadi:
3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs. CoRR abs/1901.00568 (2019)

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