"Coupled Simulation of Transient Heat Flow and Electric Currents in Thin ..."

Thorben Casper et al. (2018)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2018-10-05

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-1809-09034
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-1809-09034
Thorben Casper, Ulrich Römer, Sebastian Schöps, Herbert De Gersem:
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging. CoRR abs/1809.09034 (2018)

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