"Novel Bonding technologies for wafer-level transparent packaging of MOEMS"

Herwig Kirchberger, Paul Lindner, Markus Wimplinger (2008)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2018-08-13

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-0802-3103
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-0802-3103
Herwig Kirchberger, Paul Lindner, Markus Wimplinger:
Novel Bonding technologies for wafer-level transparent packaging of MOEMS. CoRR abs/0802.3103 (2008)

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