"Formation of Embedded Microstructures by Thermal Activated Solvent Bonding"

S. H. Ng et al. (2008)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2024-05-21

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-0802-3064
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-0802-3064
S. H. Ng, R.-T. Tjeung, Z. F. Wang, A. C. W. Lu, I. Rodriguez, N. De Rooij:
Formation of Embedded Microstructures by Thermal Activated Solvent Bonding. CoRR abs/0802.3064 (2008)

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