"Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic ..."

Jeong-Won Yoon et al. (2007)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2018-08-13

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-0711-3323
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-0711-3323
Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung:
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications. CoRR abs/0711.3323 (2007)

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