"Wafer Scale Interconnections for GaAs Packing - Applications to RISC ..."

Jack F. McDonald et al. (1987)

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DOI: 10.1109/MC.1987.1663533

access: closed

type: Journal Article

metadata version: 2020-08-12

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  - https://dblp.org/rec/journals/computer/McDonaldGSDB87
Jack F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl:
Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. Computer 20(4): 21-35 (1987)

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