"3D resistive RAM cell design for high-density storage class memory - a review."

Boris Hudec et al. (2016)

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DOI: 10.1007/S11432-016-5566-0

access: closed

type: Journal Article

metadata version: 2024-10-06

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Boris Hudec, Chung-Wei Hsu, I-Ting Wang, Wei-Li Lai, Che-Chia Chang, Taifang Wang, Karol Fröhlich, Chia-Hua Ho, Chen-Hsi Lin, Tuo-Hung Hou:
3D resistive RAM cell design for high-density storage class memory - a review. Sci. China Inf. Sci. 59(6): 061403:1-061403:21 (2016)

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