"A physics-based electromigration reliability model for interconnects ..."

Linlin Cai et al. (2021)

> Home

Details and statistics

DOI: 10.1007/S11432-020-3140-4

access: closed

type: Journal Article

metadata version: 2021-12-29

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/chinaf/CaiCKDLZ21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/chinaf/CaiCKDLZ21
Linlin Cai, Wangyong Chen, Jinfeng Kang, Gang Du, Xiaoyan Liu, Xing Zhang:
A physics-based electromigration reliability model for interconnects lifetime prediction. Sci. China Inf. Sci. 64(11) (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.