"Leaf area index estimation under wheat powdery mildew stress by ..."

Yang Liu et al. (2023)

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DOI: 10.1016/J.COMPAG.2023.108169

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type: Journal Article

metadata version: 2024-02-07

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Yang Liu, Lulu An, Nan Wang, Weijie Tang, Minjia Liu, Gouhui Liu, Hong Sun, Minzan Li, Yuntao Ma:
Leaf area index estimation under wheat powdery mildew stress by integrating UAV‑based spectral, textural and structural features. Comput. Electron. Agric. 213: 108169 (2023)

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