"Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels ..."

David Cuesta et al. (2015)

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DOI: 10.1016/J.ASOC.2015.04.052

access: closed

type: Journal Article

metadata version: 2022-10-02

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David Cuesta, José L. Risco-Martín, José L. Ayala, José Ignacio Hidalgo:
Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization. Appl. Soft Comput. 34: 164-177 (2015)

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