"A Method for Wafer Defect Detection Using Spatial Feature Points Guided ..."

Jing Yang et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2020.2990535

access: open

type: Journal Article

metadata version: 2021-10-25

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/YangXRDZ20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/YangXRDZ20
Jing Yang, Yi Xu, Hai-Jun Rong, Shaoyi Du, Hongmei Zhang:
A Method for Wafer Defect Detection Using Spatial Feature Points Guided Affine Iterative Closest Point Algorithm. IEEE Access 8: 79056-79068 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.