"Thermal Field Simulation and Analysis of Tulip Contact Based on Virtual ..."

Yongcong Wu et al. (2023)

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DOI: 10.1109/ACCESS.2023.3278280

access: open

type: Journal Article

metadata version: 2023-06-15

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Yongcong Wu, Hansheng Cai, Yi Zhang, Shang-Mao Hu:
Thermal Field Simulation and Analysis of Tulip Contact Based on Virtual Material Method. IEEE Access 11: 53538-53544 (2023)

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