"3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems."

Sang-Hee Shin et al. (2022)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2022.3167437

access: open

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/ShinPZSSRL22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/ShinPZSSRL22
Sang-Hee Shin, Roshan Payapulli, Liyan Zhu, Manoj Stanley, Xiaobang Shang, Nick M. Ridler, Stepan Lucyszyn:
3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems. IEEE Access 10: 41708-41719 (2022)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.