"Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using ..."

Zilian Qu et al. (2019)

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DOI: 10.1109/ACCESS.2019.2921005

access: open

type: Journal Article

metadata version: 2019-07-05

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Zilian Qu, Wensong Wang, Shuhui Yang, Quqin Sun, Zhongyuan Fang, Yuanjin Zheng:
Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application. IEEE Access 7: 75330-75341 (2019)

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