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"Heat Transfer Modeling and Oven Temperature Curve Optimization of ..."

Geng Ma, Xiaoqing Huang, Shihao Liu (2021)

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DOI: 10.1109/ACCESS.2021.3120496

access: open

type: Journal Article

metadata version: 2021-11-03

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Geng Ma, Xiaoqing Huang, Shihao Liu:
Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering. IEEE Access 9: 141876-141889 (2021)

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