"Time-Series Forecast-Based Endpoint Thickness Compensation for Thinning of ..."

Yu-Kun Lin, Bing-Fei Wu (2023)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2023.3247430

access: open

type: Journal Article

metadata version: 2023-03-28

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/LinW23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/LinW23
Yu-Kun Lin, Bing-Fei Wu:
Time-Series Forecast-Based Endpoint Thickness Compensation for Thinning of Sapphire Wafer. IEEE Access 11: 21252-21263 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.