"Study on Chip Reliability Modeling Based on Mutually Dependent Competing ..."

Longteng Li et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2020.3037368

access: open

type: Journal Article

metadata version: 2024-10-17

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/LiJHJPS20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/LiJHJPS20
Longteng Li, Bo Jing, Jiaxing Hu, Xiaoxuan Jiao, Jinxin Pan, Hongda Sun:
Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes. IEEE Access 8: 204695-204708 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.