"A Health Indicator for Interconnect structure of QFP Package Under ..."

Jiaxing Hu et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2020.3007365

access: open

type: Journal Article

metadata version: 2020-07-31

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/HuJHJSL20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/HuJHJSL20
Jiaxing Hu, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li:
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. IEEE Access 8: 122898-122907 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.